Xmsig and Phoenix Pioneer Sign the Cooperation Agreement
On the afternoon of April 16, 2018, Xiamen Haicang District People's Government and Xinzhou Science and Technology (Xiamen) Co., Ltd. signed a cooperative contract for the high-end packaging board project and the signing ceremony of the agreement between Xiamen Semiconductor Investment Group Co., Ltd. and Xinzhou Science and Technology (Xiamen) Co., Ltd. for capital increase and stock expansion was held in Xiamen. Xiamen Semiconductor Investment Group will invest in the development, design and manufacturing base of high-end packaging panels in Haicang District of Xiamen with Xinzhou Science and Technology.